Thermal Copper Pillar Bump

Thermal Copper Pillar Bump

Fouad Sabry

Språken

FörlagOne Billion Knowledgeable

ISBN6610000390236

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(Reklamlänk)

What Is Thermal Copper Pillar Bump The thermal copper pillar bump is a thermoelectric device that is made from thin-film thermoelectric material and is embedded in flip chip interconnects. It is used in the packaging of electronic and optoelectronic components, such as integrated circuits (chips),

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